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TVS Diode Arrays (SPA ? Diodes)
Low Capacitance ESD Protection - SP3012 Series
Package Dimensions — μDFN-14 (3.5x1.35x0.5mm)
Top View
μDFN-14 (3.5x1.35x0.5mm)
D
A
JEDEC MO-229
PIN 1 Index Area
1 2 3 4
E
B
Symbol
Min
Millimeters
Nom
Max
Min
Inches
Nom
Max
Side View
A
0.45
0.50
0.55
0.018
0.020
0.022
Seating
Plane
A
C
b
A1
A2
A1
A2
b
D
0.00
0.15
3.40
0.02
0.203 Ref
0.20
3.50
0.05
0.25
3.60
0.000
0.006
0.134
0.001
0.008 Ref
0.008
0.138
0.002
0.012
0.142
D2
-
-
-
-
-
-
Bottom View
E
E1
1.25
-
1.35
-
1.45
-
0.050
-
0.054
-
0.058
-
e
0.500 BSC
0.020 BSC
L
0.25
0.30
0.35
0.010
0.012
0.014
Pin 1 Identi?cation
Chamfer 0.10X45o
Recomended
Soldering Pad Layout
Notes:
1. Dimension and tolerancing comform to ASME Y14.5M-1994.
2. Controlling dimensions: Millimeter. Converted Inch dimensions are not necessarily
exact.
Soldering Pad Layout Dimensions
Symbol
Millimeter Symbol
Millimeters
Inches
Min Nom
Max
Min
Inches
Nom
Max
D
E
b
L
3.29
1.44
0.29
0.39
3.30
1.45
0.30
0.40
3.31
1.46
0.31
0.41
0.1295
0.0567
0.0114
0.0154
0.1299
0.0571
0.0118
0.0158
0.1303
0.0575
0.0122
0.0161
e
0.50 typ
0.020 typ
s
s1
0.19
0.64
0.20
0.65
0.21
0.66
0.0075
0.0252
0.0078
0.0256
0.0083
0.0260
Embossed Carrier Tape & Reel Speci?cation — μDFN-14
P1
P2
P0
D0
E
User Feeding Direction
Symbol
A0
Millimeters
1.58 +/- 0.10
B0
D0
3.73 +/- 0.10
0.60 + 0.05
F
D1
? 0.60 + 0.05
W
Pin 1 Location
E
F
1.75 +/- 0.10
5.50 +/- 0.05
D1
A0
T
K0
P0
P1
0.68 +/- 0.10
2.00 +/- 0.05
4.00 +/- 0.10
P2
4.00 +/- 0.10
?2013 Littelfuse, Inc.
Specifications are subject to change without notice.
K0
B0
7
T
W
0.28 +/- 0.02
12.00 + 0.30 /- 0.10
SP3012 Series
Revision: 09 2, 13
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